Paste for electronic materials│TOYOBO PRODUCT LINEUP│VYLON®　HARDLEN®・TOYO-TAC® │TOYOBO

TOYOBO MC Corporation

VYLON®
HARDLEN®・TOYO-TAC®

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Outline

    • ● Excellent formability
    • ● No crack after forming process
    • ● Excellent adhesion to PC/PET Film

Feature

Toyobo's pastes for electronic applications are developed based on the highly polymerized co-polyester resin technology (VYLON®) accumulated for many years.

Process

  • Step 1

    Substrate

  • Step 2

    Printing

  • Step 3

    Curing

  • Step 4

    Forming

Spec・Quality

Properties

Grade Type Filler Viscosity Pencil
hardness		 Volume resistivity
(Ω・cm)		 Features
dPa・s/25℃
DW-250H-5 Themosetting Silver 270 2H 3.5×10-5 Low resistance
Bending performance
DW-520H Series Themosetting Silver 400 2H 1.0×10-4 Adhesion to ITO
Laser etching type
DW-420L-2 Lacquer Silver 180 2H 5.0×10-5 Adhesion to ITO
Low temperature drying
DW-351H Series Themosetting Silver 185 2H 3.0×10-5 Low temperature curing
Low resistance
DW-545 Themosetting Silver 600 2H 5.0×10-4 Adhesive
DY-150H-30 Themosetting Carbon 100 2H 2.0×10-1 General grade
DY-280H-3 Themosetting Carbon 350 2H 8.0×10-2 Bending performance

After forming

TOYOBO MC Corporation