Electromagnetic wave shield housing made of resin suitable for plating and reflow processes
VYLOAMIDE®
Features
- ● Plating adhesion: Compatible with ABS plating lines, excellent adhesion strength
- ● Reflow soldering resistance: Low water absorption reduces blisters, making it suitable for surface mounting
- ● High flow: Effective for molding complicated designs
- ● Eco-friendly materials: Uses plant-derived materials, environmentally friendly
Spec・Properties
- <<Physical properties table>>
| Grade name | VYLOAMIDE® MJ-376KD |
GLAMIDE® T-777-02 |
PA6 |
|---|---|---|---|
| Features | Plating adhesion and reflow soldering resistance |
Plating adhesion | ー |
| Composition | PPA + X reinforced | PA6 + X reinforced | PA6 + GF reinforced |
| Melting point (°C) | 315 | 225 | 225 |
| Reflow soldering | 〇 | × | × |
| Plating Process Compatibility | ABS plating line | Hydrochloric acid etching line | × |
CONTACT
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