• Electromagnetic wave shield housing made of resin suitable for plating and reflow processes

    VYLOAMIDE®

Features

  • Plating adhesion: Compatible with ABS plating lines, excellent adhesion strength
  • Reflow soldering resistance: Low water absorption reduces blisters, making it suitable for surface mounting
  • High flow: Effective for molding complicated designs
  • Eco-friendly materials: Uses plant-derived materials, environmentally friendly

Spec・Properties

  • <<Physical properties table>>
Grade name VYLOAMIDE®
MJ-376KD
GLAMIDE®
T-777-02
PA6
Features Plating adhesion and
reflow soldering resistance
Plating adhesion
Composition PPA + X reinforced PA6 + X reinforced PA6 + GF reinforced
Melting point (°C) 315 225 225
Reflow soldering × ×
Plating Process Compatibility ABS plating line Hydrochloric acid etching line ×