• Conductive Paste for forming

Features

  • ● By mixing metal powder and Vylon, a conductive paste that follows the elongation during forming is developed.
  • ● No crack and keep resistance values after forming process.
  • ● Excellent adhesion to PC and PET substrate.

Specification・Performance

  • ● Process

  • ● Properties
Grade name Unit DF-3619 PLA-35 Remarks
Viscosity dPa・s 700 2000 Viscotester
VT-04
Volume resistivity Ω・㎝ 1.5×10-4 5.0×10-5 ー
Adhesion ー 100/100 100/100 ISO 2409
Curing condition ー 100~120℃
×30min
100~120℃
×30min
Box Oven
  • ※The data listed is not a guaranteed value.
  • ※Contents are subject to change without permission
  • ● Formability

    • ● Applications

    • Curved surface touch sensor
    • Alternative of wire harness
    • Curved surface heater

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